TeraSpan to Exhibit at OSP Expo 2012

November 2, 2012 — TeraSpan will be exhibiting at the OSP Expo, November 13-15 in Denver Colorado. Come see our newest innovation in micro trenching technology, the Square Profile Conduit (SPC)! The SPC expands TeraSpans innovative products designed to lower cost, accelerate deployment and minimize community impact when deploying fiber optic networks. We look forward to seeing you in Denver!

Read More...