November 2, 2012 — TeraSpan will be exhibiting at the OSP Expo, November 13-15 in Denver Colorado. Come see our newest innovation in micro trenching technology, the Square Profile Conduit (SPC)! The SPC expands TeraSpans innovative products designed to lower cost, accelerate deployment and minimize community impact when deploying fiber optic networks. We look forward to seeing you in Denver!
TeraSpan's VIF system is the premier solution for service between buildings.
VIF technology provides the flexibility and cost savings to make FTTH a reality
We lead the way in the last mile revolution to meet the demand for high bandwidth services
Extend existing fiber footprint to reach new subscribers and service areas.